What’s New

What’s New

Call for papers: The deadline for abstract submission has been extended to April 30, 2018

Author
admin
Date
2018-03-06 16:52
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563
Conference Information

Title  15th International Symposium on Novel and Nano Materials (ISNNM-2018)

Period  July 1 - July 6, 2018

Venue  Tivoli Oriente Hotel, Lisbon, Portugal

Organized by Korean Powder Metallurgy Institute

 Conference Scope : The scope of the conference will be broad, covering all aspects of novel and nano materials.

 Symposia

  •  Advanced Materials Processing

  •  Advanced Powder Metallurgy

  •  Additive Manufacturing(3D Printing) and MIM

  •  Characterization and Modeling

  •  Energy and Functional Materials

  •  Nanocomposites and Nanoporous Materials

  •  Rare Metals and Recycling

  •  Refractory Metals and Hard Materials


Important Dates

- Abstract submission  30 April 2018

- Early registration  30 April 2018

- Full Paper due 6 July 2018

Organization

General chair    : Dr. Yong-Jin KIM  / Dr. Chang Kyu RHEE / Prof. Jan DUSZA / Prof. Paweł ZIEBA

Secretary General : Prof. Sung-Tag OH

Call for Abstracts and Papers

The organizing committee of ISNNM 2018 invites all interested individuals to submit abstracts to be considered for oral/poster presentation. The presentation will be grouped according to the symposia listed above. Anyone who is interested in oral/poster presentation should submit an abstract no later than by 31 March 2018.

Abstract should be submitted on-line only through the conference website www.isnnm.org

Registraion Fee
  Early
(Until 15 April 2018)
On-site
(16 April to 23 June 2018)
On-site (Cash only)
Regular 700 USD
(770,000 KRW)
800 USD
(880,000 KRW)
800 USD
(880,000 KRW)
Student 500 USD
(550,000 KRW)
550 USD
(605,000 KRW)
550 USD
(605,000 KRW)
Spouse 200 USD
(220,000 KRW)
Full Paper

Authors whose abstracts are accepted will be kindly requested to submit the 4 page full paper from beginning of March till 1 July. 2018. (Full paper form of each journal will be announced soon.) Selected papers will be published in SCI/SCIE journals after peer review.